Bi Technologies

MODEL	DESCRIPTION	ASSEMBLY	PACKAGE	SUBSTRATE	OPERATING TEMPERATURE
165 Series	Custom Hybrid Microcircuit or MCM	Epoxy Mounted Die Substrate w/Integral Resistors, Gold or AL Bonds	Hermetic Metal, Ceramic, Plastic Encapsulated	Thick Film, Thin Film or Cofired Ceramic (HTCC, LTCC)	-55°C to +125°C Optional: Up to +200°

Applications : Avionic Systems, Communication Guidance/Control Systems, Medical Implantables, High Temperature , Environments

MODEL	DESCRIPTION	ASSEMBLY	PACKAGE	SUBSTRATE	OPERATING TEMPERATURE
170 Series	Custom Module, Power Switching up to 500 Amp Peak	Solder Mounted Die, High Current Traces Insulated Backplate Heavy Gage Al Bonds	Encapsulated, Integral Mounting Flange	Direct Bond Copper (DBC) or Insulated Metal (IMS)	-40°C to +125°C
7700 Series	Standard 20 Amp, 25 Amp Power Factor Correction Module (PFC)
7720 Series	Standard 10 Amp, 15 Amp, 20 Amp Power Factor Correction Module (PFC)
7721 Series	22 Amp, 32 Amp H-Bridge Modules w/Thermal Protection

Applications : Power Supplies, Motor Drive/Controls, DC/DC Converters, UPS, Audio Amplifiers

MODEL	DESCRIPTION	ASSEMBLY	PACKAGE	SUBSTRATE	OPERATING TEMPERATURE
143 Series	Custom module	Surface Mount Components Single or Multilayer substrate w/Integral Resistors	Open Frame Conformal Coated Encapsulated Polymer Housing SIP, DIP, or SMT	Thick Film Ceramic	0°C ~ +70°C (Standard:) -25°C ~ +85°C (Optional:)
830-004 Standard	Universal Line Voltage 6 Watt DC/DC Converter

Applications : Industrial, Automotive, Portable Electronics, White Goods, Telecommunications