| Chairman | : | Mr. Sammy Yip |
| Company Established | : | 1988 |
| Location (Factory) | : | Chung Tou Industrial Zone |
| Contact Information | : | www.redboard.com.cn |
| Factory (Total Floor Area) | : | 648,000 square feet |
| Production Capacity | : | 1,300,000 square feet per month |
| Products | : | Double-Sided, Multilayered & HDI Printed Circuit Boards |
| ISO Certification | : | ISO9001: 2000 Certificate # C041149/A ISO14001: 1996 Certificate # 268 ISO/TS16949: 2002 Certificate # C041149 |
| UL Recognition | : | File # E133472 |
| Total Employees | : | 3000 |
Present Product Technology
| Product Range | |
| * Double-Sided | CEM-3, FR-4, Rogers RO4233, and Bergquist Thermal Clad Laminate 8mil – 120 mil (0.2mm - 3.0mm) |
| * Multilayer | 4 - 16 Layers with board thickness of 15mil - 120mil (0.38mm - 3.0mm) |
| * BVH | 4 - 12 Layers with board thickness of 15mil - 62mil (0.38mm - 1.6mm) |
| * HDI | 1+N+1, 1+1+N+1+1, 2+N+2, 3+N+3, 1+1+1+N+1+1+1, RCC or LDP |
| * Major Laminates | Shengyi & Kingboard |
| * Green Products | D/S, Multilayer and HDI (ROHS, Halogen-Free Compliance) |
Product Finishing
| * | Liquid Photo-imageable Solder mask (LPI) : Taiyo, Goo’s, Probimer |
| * | Peelable Solder mask : Peters |
| * | Conductive Carbon Ink |
| * | Hot Air Solder Leveled (Eutectic or Lead-free HASL) with Thickness of 40 to 1,000 m in (1 - 25 mm) |
| * | Organic Solderability Preservatives: Entek Plus HT, Preflux F2 LX |
| * | Immersion Gold with Thickness of Au: 2 to 5 m in (0.05 ~ 0.125 mm); Ni: 120 ~ 250 m in (3.00~6.25 mm) |
| * | Electrolytic Bondable Ni-Au with Thickness Au: min.12 m in ( 0.3 mm); Ni:120 ~ 600 m in (3 ~ 15 mm) |
| * | Gold Tab Plating with Thickness of Au: 5 ~ 30 m in (0.125 ~ 0.750 mm); Ni:100 ~ 250 m in (2.50~6.25mm ) |
| * | Immersion Tin with Thickness of min. 40 m in (1.0 mm) |
| Capability | Normal |
Advanced |
| * Min. Mechanical Drilled Hole Size | 16mil (0.400mm) | 8mil (0.200mm) |
| * Min. Laser Drilled Hole Size | 5mil (0.125mm) | 4mil (0.100mm) |
| * Line Width/Spacing | 5mil (0.125mm) | 3mil (0.075mm) |
| * Maximum Production panel size | 21.5” x 24.5” (546mm x 622mm) |
|
| Feature | Normal | Advanced |
| * Line width/spacing | +/-20% | +/-10% |
| * PTH Diameter | +/-0.003 inch (0.075mm) | +/-0.002 inch (0.050mm) |
| * Non-PTH Diameter | +/-0.002 inch (0.050mm) | +/-0.002 inch (0.050mm) |
| * Hole Location | +/-0.003 inch (0.075mm) | +/-0.002 inch (0.050mm) |
| * Hole to Edge Dimension | +/-0.005 inch (0.125mm) | +/-0.004 inch (0.100mm) |
| * Edge to Edge Dimension | +/-0.006 inch (0.150mm) | +/-0.005 inch (0.125mm) |
| * Layer to Layer Registration | +/-0.005 inch (0.125mm) | +/-0.005 inch (0.125mm) |
| * Controlled Impedance | +/- 10% | +/- 7% |
| * Allowable Warpage | Max. 1.0 % | Max. 0.5% |
Capability for HDI
